|
|
Hyeon-Seok Yang, Nu-Si-A Eom, Ji-Won Kim, Jae-Hong Im |
| 응력 주입 층을 이용한 Kerf-less 웨이퍼링 기술 동향 |
|
양현석, 엄누시아, 김지원, 임재홍 |
|
한국기계연구원 부설 재료연구소 |
|
|
| Abstract |
|
In the photovoltaics (PV) industry, there were many efforts to reduce the cost of production with high efficiency. The single most important cost factor in silicon technology is the wafer, accounting presently for ~35% of the module cost. it was already shown that the solar cell efficiency can be maintained up to the thickness range of $40-60{mu}m$. The direct production of ultra-thin silicon wafer is very attractive and numerous different techniques, such as electrochemical process, ion implantation, and epitaxial growth, have been proposed and developed in many academic and industrial laboratories. |
| Key Words:
Kerfless, wafering technique, photovoltaic |
|
PDF Links
Full text via DOI
Download Citation
E-Mail
